期刊論文(共計6筆) |
序號 | 學年度 | 學期 | 年度 | 月份 | 作者 | 題目 | 通訊作者 | 作者順位 | 期刊名稱 | 卷數 | 頁數 | 關鍵字 |
1 | 091 | 2 | 2003 | 3 | D. S. Liu, Y. C. Chao | Effects of Dopant, Temperature and Strain Rate on the Mechanical Properties of Micrometer Gold Bonding Wire | 否 | 第二順位 | Journal of Electronic Materials | 32 | 159-165 | |
2 | 091 | 2 | 2003 | 5 | Y. C. Chao, D. S. Liu | Gold Wire and Solder Joint Microforce Testing Using Microforce Tester | 是 | 第一順位 | Experimental Techniques | 27 | 37-40 | |
3 | 091 | 2 | 2003 | 6 | D. S. Liu, Y. C. Chao, C. H. Lin, G.S. Shen and H. S. Liu | Numerical Study on the Bonding Tool Position, Tip Profile and Planarity angle influences on TAB/ILB interconnection reliability | 否 | 第二順位 | Microelectronics Reliability | 43 | 935-943 | |
4 | 092 | 2 | 2004 | 3 | D. S. Liu, Y. C. Chao and C. H. Wang | Study of wire bonding looping formation in the electronic packaging process using the three dimensional finite element method | 否 | 第二順位 | Finite Element in Analysis and Design | 40 | 263-286 | |
5 | 112 | 1 | 2023 | 11 | 2. De-Shin Liu, Po-Chun Wen, Zhen-Wei Zhuang, Yung-Ching Chao, and Pei-Chen Huang | Temperature-Dependence Mechanical Characteristics Investigation of Cu Wire and Corresponding High Strain Rate Plasticity Behaviors Enabled by Johnson-Cook Constitutive Model | 否 | 其他 | Journal of Mechanics | 39 | 334-343 | |
6 | 113 | 1 | 2024 | 11 | 1. Yuk-Wah Tsang, Hsiao-Ju Fu, Zhen-Wei Zhuang, Cho-Liang Chung, Pei-Chen Huang, Yung-Ching Chao and | Demonstration of curing degree estimation approach of EVA foam during injection moulding by integrating thermal-physical characteristics and FEA simulation | 否 | 其他 | Polymer Bulletin | 82 | 1643-1662 | |
會議論文(共計4筆) |
序號 | 學年度 | 學期 | 年度 | 月份 | 作者 | 題目 | 通訊作者 | 作者順位 | 發表性質 | 會議論文集或研討會名稱 | 地點 |
1 | 113 | 1 | 2024 | 10 | D.S. Liu, Y.H. Li, P.C. Wen, Z.W. Zhuang, C.W. Wang, Y.C. Chao, M.K. Shih, and P.C. Huang | Demonstration on SAC305 solder fatigue life prediction methodology in view of S-N curve on BGA packaging under vibration loading | 否 | 其他 | 口頭發表 | IMPACT 2023, 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference | |
2 | 113 | 1 | 2024 | 11 | 姚仲恆, 張庭昇, 趙永清 | 電子封裝元件焊錫接點疲勞模型與幾何因子對於熱循環壽命影響之探討 | 是 | 第三順位 | 口頭發表 | 中國機械工程學會第41屆全國學術研討會 | 高科大 |
3 | 113 | 1 | 2024 | 11 | 陳健祐、張庭昇、趙永清 | 電子封裝磁性薄膜電感元件之電磁特性研究 | 是 | 第三順位 | 口頭發表 | 中國機械工程學會第41屆全國學術研討會 | 高科大 |
4 | 112 | 2 | 2024 | 4 | D.S. Liu, P.C. Wen, Z.W. Zhuang, Y.C. Chao, and P.C. Huang | Temperature dependence mechanical characteristics of Ag alloy wire and corresponding influence in wire bonding procedure | 否 | 其他 | 口頭發表 | 2024 International Conference on Electronics Packaging, Japan | |